Heat dissipation sheet - Company Ranking(9 companyies in total)
Last Updated： Aggregation Period:Jul 16, 2025〜Aug 12, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Product Name: Thermo-TranzUTW - Thermal Conductivity: 6.0 W/m·K (ASTM D5470) - Size: 30mm × 30mm × Thickness 0.5mm - Thermal Resistance Value: 0.67 °C·cm²/W - Hardness: 30 JIS Type E - Specific Gravity: 1.8 - Volume Resistivity: ≧ 1 × 10^10 - Dielectric Breakdown Strength: 1.0 AC kV/mm - Flame Retardancy: V-0 UL94 - Operating Temperature Range: -40°C to 150°C - Insulation Properties - Double-sided Adhesive Properties | - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs. | ||
| Product Name: Thermo-TranzVW - Thermal Conductivity: 12.0 W/m·K (ASTM D5470) - Size: 30mm × 30mm × Thickness 0.5mm - Thermal Resistance Value: 0.45 °C·cm²/W - Hardness: 30 JIS Type E - Specific Gravity: 2.4 - Volume Resistivity: ≧ 1 × 10^10 - Dielectric Breakdown Strength: 0.9 AC kV/mm - Flame Retardancy: V-0 UL94 - Operating Temperature Range: -40°C to 150°C - Insulation Properties - Double-Sided Adhesive | - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs. | ||
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- Featured Products
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Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzUTW
- overview
- Product Name: Thermo-TranzUTW - Thermal Conductivity: 6.0 W/m·K (ASTM D5470) - Size: 30mm × 30mm × Thickness 0.5mm - Thermal Resistance Value: 0.67 °C·cm²/W - Hardness: 30 JIS Type E - Specific Gravity: 1.8 - Volume Resistivity: ≧ 1 × 10^10 - Dielectric Breakdown Strength: 1.0 AC kV/mm - Flame Retardancy: V-0 UL94 - Operating Temperature Range: -40°C to 150°C - Insulation Properties - Double-sided Adhesive Properties
- Application/Performance example
- - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzVW
- overview
- Product Name: Thermo-TranzVW - Thermal Conductivity: 12.0 W/m·K (ASTM D5470) - Size: 30mm × 30mm × Thickness 0.5mm - Thermal Resistance Value: 0.45 °C·cm²/W - Hardness: 30 JIS Type E - Specific Gravity: 2.4 - Volume Resistivity: ≧ 1 × 10^10 - Dielectric Breakdown Strength: 0.9 AC kV/mm - Flame Retardancy: V-0 UL94 - Operating Temperature Range: -40°C to 150°C - Insulation Properties - Double-Sided Adhesive
- Application/Performance example
- - For cooling the CPU of a computer and the GPU of a graphics card - Ideal for cooling Intel Socket LGA115x CPUs.
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